Specific Process Knowledge/Lithography/Descum: Difference between revisions
No edit summary |
|||
| Line 11: | Line 11: | ||
[[File:Descum Results aug 2019.png|640px|thumb|right|Descum results plasma asher 1. September 2019]] | [[File:Descum Results aug 2019.png|640px|thumb|right|Descum results plasma asher 1. September 2019]] | ||
The user manual(s), quality control procedure(s) and results and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=55 LabManager] - '''requires login''' | |||
Descum of AZ5214E resist on 50mm silicon wafer. Wafer was placed horisontally in chamber on a 100 mm carier wafer. | Descum of AZ5214E resist on 50mm silicon wafer. Wafer was placed horisontally in chamber on a 100 mm carier wafer. | ||