Specific Process Knowledge/Lithography/Development/DUV developer: Difference between revisions
Appearance
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{| border="2" cellspacing="0" cellpadding="2" | {| border="2" cellspacing="0" cellpadding="2" | ||
!style="background:silver; color:black; | !style="background:silver; color:black;" width="60"|Purpose | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
|style="background:WhiteSmoke; color:black" colspan="2"| | |style="background:WhiteSmoke; color:black" colspan="2"| | ||
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!style="background:silver; color:black; | !style="background:silver; color:black;" width="60"|Developer | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black" colspan="2"| | ||
2,38% water based TMAH | 2,38% water based TMAH | ||
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!style="background:silver; color:black | !style="background:silver; color:black" valign="center" rowspan="3"|Process parameters | ||
|style="background:LightGrey; color:black"|Spin speed | |style="background:LightGrey; color:black"|Spin speed | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black" colspan="2"| | ||
10 - 5000 rpm | 10 - 5000 rpm | ||
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|style="background:LightGrey; color:black"|Spin acceleration | |style="background:LightGrey; color:black"|Spin acceleration | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black" colspan="2"| | ||
100 - 10000 rpm/s | 100 - 10000 rpm/s | ||
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|style="background:LightGrey; color:black"|Hotplate temperature | |style="background:LightGrey; color:black"|Hotplate temperature | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black" colspan="2"| | ||
130°C for post exposure baking | 130°C for post exposure baking | ||
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!style="background:silver; color:black | !style="background:silver; color:black" valign="center" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
|style="background:WhiteSmoke; color:black" | |style="background:WhiteSmoke; color:black" colspan="2"| | ||
*100 mm wafers | *100 mm wafers | ||
*150 mm wafers | *150 mm wafers | ||
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| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black" colspan="2"| | ||
*Any standard cleanroom material | *Any standard cleanroom material | ||
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|style="background:LightGrey; color:black"|Batch | |style="background:LightGrey; color:black"|Batch | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black" colspan="2"| | ||
1 - 25 | 1 - 25 | ||
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|} | |} | ||
<br clear="all" /> | <br clear="all" /> | ||