Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 03 processing: Difference between revisions
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The standard range for the defocus parameter is -10 to 10, but a special feature allows to extend this range to -25 to 25, which may be useful when exposing thick resist. The large defocus range feature is activated in the resist template, and can only be accessed by asking staff to set up a custom resist template. | The standard range for the defocus parameter is -10 to 10, but a special feature allows to extend this range to -25 to 25, which may be useful when exposing thick resist. The large defocus range feature is activated in the resist template, and can only be accessed by asking staff to set up a custom resist template. | ||
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==CD Bias== | |||
The size after development of the structures printed on Aligner: Maskless 03 is not necessarily 1:1 with the design. Tests have shown that 3µm lines of resist printed in positive resist using quality mode on Aligner: Maskless 03 resist are 0.4-0.8µm too narrow, i.e. the exposed and subsequently developed area is wider than in the design. This bias is a function of the dose, and gets bigger with higher dose. It is also different for different resists. At the dose that appears to give the best resolution for AZ 5214E, the bias is 0.7µm, while it is approximately 0.45µm for MiR 701. | |||
[[Image:MLA3_5214E_3umLS_bias.JPG|400x400px|thumb|The effect of applying CD Bias during conversion on Aligner: Maskless 03]] | |||
During design conversion ... | |||
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=Alignment= | =Alignment= | ||