Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions
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The oven is typically used for dehydration pretreatment, of Si and glass substrates, to promote the resist adhesion. We recommend placing the wafers in a metal carrier in the oven for at least for 4 hours, or overnight, and spin coat resist on them as soon as possible after removing them from the oven. | The oven is typically used for dehydration pretreatment, of Si and glass substrates, to promote the resist adhesion. We recommend placing the wafers in a metal carrier in the oven for at least for 4 hours, or overnight, and spin coat resist on them as soon as possible after removing them from the oven. | ||
The user manual, and contact information can be found in LabManager: | |||
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=117 Oven 250C] - '''requires login''' | |||
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