Revision as of 09:41, 1 February 2023

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Techniques, hardware and challenges common to all dry etch tools

This page contains information that is common to dry etch instruments.

Dry etch page	Description
Hardware comparison	Comparison of the different hardware setups
Using carrier wafer	Processing different sizes of substrates by using a carriers: bonding or not bonding
Optical Endpoint System	Using the OES technique to find endpoints and to diagnose plasmas
LASER Endpoint System	Using the LEP technique to find endpoints between interfaces or at a etch depth (in transparent layers)
Etch product volatility	Links to various tables with data on etch product volatility

Revision as of 09:41, 1 February 2023 view source Jmli (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 4,416 edits No edit summary ← Older edit		Revision as of 09:41, 1 February 2023 view source Jmli (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 4,416 edits No edit summary Newer edit →
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	This page contains information that is common to dry etch instruments.		This page contains information that is common to dry etch instruments.

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