Specific Process Knowledge/Etch/Etching of Silicon: Difference between revisions
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|Possible masking materials: | |Possible masking materials: | ||
|Silicon Nitride | | | ||
*Silicon Nitride | |||
|? | |? | ||
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*Aluminium | *Aluminium | ||
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|Etch rate | |||
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|Size of substrate | |||
|4" and 6" in our standard bath | |||
|4" in our standard bath | |||
|4" (or smaller with carrier) | |||
|6" (when it is set up for 6") and 4" (or smaller if you have a carrier) | |||
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|Process volume | |||
|25 wafers at a time | |||
|25 wafers at a time | |||
|One wafer at a time | |||
|One wafer at a time | |||
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