Specific Process Knowledge/Etch/AOE (Advanced Oxide Etch): Difference between revisions
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|style="background:LightGrey; color:black"|Batch size | |style="background:LightGrey; color:black"|Batch size | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*1 6" wafer per run (only when the system is setup to 6" | *1 6" wafer per run (only when the system is setup to 6") | ||
*1 4" wafer per run | *1 4" wafer per run | ||
*1 2" wafer per run (needs carrier) | *1 2" wafer per run (needs carrier) | ||
| Line 63: | Line 63: | ||
*Silicon/PolySi | *Silicon/PolySi | ||
*Aluminium | *Aluminium | ||
*Chromium | |||
|- | |- | ||
|} | |} | ||