Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/ORE with Al2O3 mask: Difference between revisions

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-{| border="1" style="text-align: center; width: 900px; height: 200px"
+{| border="1" style="text-align: center; width: 1500px; height: 200px"
 |+ '''Samples profile before going for the ORE process:'''
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 ! !! After Al<sub>2</sub>O<sub>3</sub> etch !! Comments
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-| ''' 1 µm pillars''' || [[File:Pillar 0C+S-RIE Al2O3 02bbbb.jpg|300px]]  [[File:Pillar 0C+S-RIE Al2O3 08bbbb.jpg|300px]] || Visible that after the 90 min Al<sub>2</sub>O<sub>3</sub> etch, the mask was correctly etched away confirmed by reaching the silicon (etched ~30nm of it).
+| ''' 1 µm pillars''' || [[File:Pillar 0C+S-RIE Al2O3 02bbbb.jpg|200px]]  [[File:Pillar 0C+S-RIE Al2O3 08bbbb.jpg|200px]] || Visible that after the 90 min Al<sub>2</sub>O<sub>3</sub> etch, the mask was correctly etched away confirmed by reaching the silicon (etched ~30nm of it).
 |-
-| ''' 1 µm holes''' || [[File:bitmapddddd.jpg|300px]]  [[File:holes.tif.jpg|300px]] || Visible that after the 90 min Al<sub>2</sub>O<sub>3</sub> etch, the mask was correctly etched away confirmed by reaching the silicon (etched ~16nm of it).
+| ''' 1 µm holes''' || [[File:bitmapddddd.jpg|200px]]  [[File:holes.tif.jpg|200px]] || Visible that after the 90 min Al<sub>2</sub>O<sub>3</sub> etch, the mask was correctly etched away confirmed by reaching the silicon (etched ~16nm of it).
 |-
 | '''200nm nanoholes''' || 2 || 220 mTorr