Specific Process Knowledge/Thermal Process/RTP Annealsys: Difference between revisions

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-!style="text-align: center" | '''Up''' = Facing the chamber; '''Up, covered''' = facing the chamber, covered with an identical (in size) Si chip during the process; '''Flipped''' = Facing the carrier wafer; '''HF dip''' = 30s-HF chemical bath, immediately prior to processing.
+'''Up''' = Facing the chamber; '''Up, covered''' = facing the chamber, covered with an identical (in size) Si chip during the process; '''Flipped''' = Facing the carrier wafer; '''HF dip''' = 30s-HF chemical bath, immediately prior to processing.
 ==== RTH ====