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Specific Process Knowledge/Lithography/Resist/UVresist: Difference between revisions

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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,999 edits
Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,999 edits
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| 1 µm
| 1 µm
| PEB: 60s @ 100°C,<br>Dev: SP60s<br> '''Due to the high dose required on this tool, it is recommended to process nLOF on tools with a more appropriate exposure light source'''
| PEB: 60s @ 100°C,<br>Dev: SP60s<br> '''Due to the high dose required on this tool, it is recommended to process nLOF on tools with a more appropriate exposure light source'''
|-style="background:WhiteSmoke; color:black"
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| 1 µm
| 1 µm
| Dev: SP60s
| Dev: SP60s
|-style="background:WhiteSmoke; color:black"
|-
|-


|-
|-
|-style="background:LightGrey; color:black"
|-style="background:silver; color:black"
!AZ 5214E image reversal<br><span style="color:green">New Japanese version</span>
!AZ 5214E image reversal<br><span style="color:green">New Japanese version</span>
| 2023-01-06<br>taran
| 2023-01-06<br>taran
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|-
|-
|-style="background:LightGrey; color:black"
|-style="background:silver; color:black"
!AZ 4562<br><span style="color:green">New Japanese version</span>
!AZ 4562<br><span style="color:green">New Japanese version</span>
| 2021-12-08<br>jehem
| 2021-12-08<br>jehem
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