Specific Process Knowledge/Lithography/Descum: Difference between revisions
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Minor temperature rise during processing was observed, but not more than 5 degrees. Starting chamber pressure was around 0.5 mbar. | Minor temperature rise during processing was observed, but not more than 5 degrees. Starting chamber pressure was around 0.5 mbar. | ||
'''1,5 um AZ5214E resist''' | |||
'''1,5 um AZ5214E resist:''' | |||
{| {{table}} | {| {{table}} | ||
| align="center" | | | align="center" | | ||
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|} | |} | ||
'''1,5 um AZ5214E resist placed horizontally in the carrier''' | |||
'''1,5 um AZ5214E resist placed horizontally in the carrier:''' | |||
{| {{table}} | {| {{table}} | ||
| align="center" | | | align="center" | | ||
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|} | |} | ||
'''1,5 um AZ701MiR resist''' | |||
'''1,5 um AZ701MiR resist:''' | |||
{| {{table}} | {| {{table}} | ||
| align="center" | | | align="center" | | ||
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|} | |} | ||
'''1,5 um AZ 2020nLOF resist''' | |||
'''1,5 um AZ 2020nLOF resist:''' | |||
{| {{table}} | {| {{table}} | ||
| align="center" | | | align="center" | | ||