Specific Process Knowledge/Lithography/Descum: Difference between revisions
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=Plasma asher 2= | =Plasma asher 2= | ||
[[image:descum_graf.jpg| | ''Jitka Urbánková & Jesper Hanberg, December 2019'' | ||
[[image:descum_graf.jpg|640px|thumb|Descum results plasma asher 2 - recipe 1]] | |||
Descum of AZ Mir 701 resist on 100mm silicon wafer. Five wafers were placed vertically in chamber. | Descum of AZ Mir 701 resist on 100mm silicon wafer. Five wafers were placed vertically in chamber. | ||
'''recipe 1''' | '''recipe 1''' | ||
*O2 flow: 100 ml/min | |||
*N2 flow: 100 ml/min | |||
*Power: 150 W | |||
{| {{table}} | {| {{table}} | ||
| align="center" | | | align="center" | | ||
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[[image:graf_descum-recipe2.png|right|frame|355x355px|Descum results plasma asher 2 - recipe 2]] | [[image:graf_descum-recipe2.png|right|frame|355x355px|Descum results plasma asher 2 - recipe 2]] | ||
'''recipe 2''' | '''recipe 2''' | ||
*O2 flow: 500 ml/min | |||
*N2 flow: 0 ml/min | |||
*Power: 200 W | |||
{| {{table}} | {| {{table}} | ||
| align="center" | | | align="center" | | ||
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A linear time dependence was observed after etching 7 minutes or more (recipe 2). | |||
<br clear="all" /> | <br clear="all" /> | ||