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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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=Spin coater: Süss stepper=
{{:Specific Process Knowledge/Lithography/Coaters/GammaDUV}}
[[Image:Gamma_2M.jpg|300x300px|right|thumb|The SÜSS Spinner-Stepper is placed in F-3]]
 
'''Feedback to this section''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/DUVStepperLithography#S.C3.9CSS_Spinner-Stepper click here]'''
 
This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch  4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), an automatic syringe system and a solvent line for cleaning and back-side rinse.
'''The user manual, quality control procedures and results, user APVs, and contact information can be found in LabManager:'''
Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=279 LabManager]
 
{{:Specific Process Knowledge/Lithography/Resist/DUVresist}}
 
===Quality Control (QC)===
 
'''THIS SECTION IS UNDER CONSTRUCTION''' [[Image:section under construction.jpg|70px]]
 
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for Spin coater: Süss Stepper - BARC DUV42S-6'''
|-
|
*[http://labmanager.dtu.dk/d4Show.php?id=5123&mach=279 The QC procedure for Spin coater: Süss Stepper]<br>
*[http://labmanager.dtu.dk/view_binary.php?fileId=4212 The newest QC data for Spin coater: Süss Stepper]
{| {{table}}
| align="center" |
{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:400px"
 
! QC Recipe:
! (1201) DCH 150mm BARC 65nm
|-
|Substrate size
|6"
|-
|Resist volume
|3 ml
|-
|Spin-off speed
|4700 rpm
|-
|Spin-off time
|30 s
|-
|Soft bake temperature
|175°C, contact
|-
|Soft bake time
|60 s
|-
|}
| align="center" valign="top"|
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:400px"
!QC limits
!Spin coater: Süss Stepper - BARC DUV42S-6
|-
|Nominal film thickness
|65 nm
|-
|Film thickness deviation from nominal
|<15%
|-
|Film thickness non-uniformity
|<5%
|-
|}
|-
|}
Spin-off speed will be adjusted if film thickness is outside the limit.
|}
 
 
 
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for Spin coater: Süss Stepper - BARC DUV42S-6'''
|-
|
*[http://labmanager.dtu.dk/d4Show.php?id=5123&mach=279 The QC procedure for Spin coater: Süss Stepper]<br>
*[http://labmanager.dtu.dk/view_binary.php?fileId=4212 The newest QC data for Spin coater: Süss Stepper]
{| {{table}}
| align="center" |
{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:400px"
 
! QC Recipe:
! (1202) DCH 100mm BARC 65nm
|-
|Substrate size
|4"
|-
|Resist volume
|1.6 ml
|-
|Spin-off speed
|3000 rpm
|-
|Spin-off time
|30 s
|-
|Soft bake temperature
|175°C, contact
|-
|Soft bake time
|60 s
|-
|}
| align="center" valign="top"|
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:400px"
!QC limits
!Spin coater: Süss Stepper - BARC DUV42S-6
|-
|Nominal film thickness
|65 nm
|-
|Film thickness deviation from nominal
|<15%
|-
|Film thickness non-uniformity
|<5%
|-
|}
|-
|}
Spin-off speed will be adjusted if film thickness is outside the limit.
|}
 
 
===Standard processes===
 
BARC DUV42S-6 coating sequences:
*'''(1201) DCH 150mm BARC 65nm''' Dispense 3ml@1000rpm; spin-off 30s@4700rpm; softbake 60s@175°C
*'''(1202) DCH 100mm BARC 65nm''' Dispense 1.6ml@1000rpm; spin-off 30s@3000rpm; softbake 60s@175°C
KRF M230Y coating sequences:
*'''(1301) DCH 150mm M230Y 360nm''' Dispense 3ml@1000rpm; spin-off 30s@2500rpm; softbake 90s@130°C
*'''(1302) DCH 100mm M230Y 360nm''' Dispense 1ml@1000rpm; spin-off 30s@2500rpm; softbake 90s@130°C
KRF M35G coating sequences:
*'''(1401) DCH 150mm M35G 750nm''' Dispense 3ml@1000rpm; spin-off 60s@5000rpm; softbake 90s@130°C
*'''(1402) DCH 100mm M35G 750nm''' Dispense 1ml@1000rpm; spin-off 60s@5000rpm; softbake 90s@130°C
*'''(1403) DCH 150mm M35G 1000nm''' Dispense 3ml@1000rpm; spin-off 60s@2630rpm; softbake 90s@130°C
*'''(1404) DCH 100mm M35G 1000nm''' Dispense 1ml@1000rpm; spin-off 60s@2630rpm; softbake 90s@130°C
*'''(1405) DCH 150mm M35G 1400nm''' Dispense 3ml@1000rpm; spin-off 60s@1310rpm; softbake 90s@130°C
*'''(1406) DCH 100mm M35G 1400nm''' Dispense 1ml@1000rpm; spin-off 60s@1310rpm; softbake 90s@130°C
 
== Equipment performance and process related parameters ==
 
{| border="2" cellspacing="0" cellpadding="2"
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" colspan="2"|
*Spin coating and soft baking of BARC
*Spin coating and soft baking of DUV resists
*Post exposure baking
|-
 
!style="background:silver; color:black;" align="center" width="60"|Resist
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
*BARC DUV42S-6
*Positive tone resist KRF M230Y
*Positive tone resist KRF M35G
*Negative tone resist UVN2300-0.8
|-
!style="background:silver; color:black;" align="center" width="60"|Performance
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
*BARC DUV42S-6 60-90nm
*Positive tone resist KRF M230Y 300-600nm
*Positive tone resist KRF M35G 800-1600nm
*Negative tone resist UVN2300-0.8 200-1400nm
|-
 
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
10 - 5000 rpm
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
100 - 10000 rpm/s
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
*175°C for BARC baking
*130°C for positive tone resist soft baking and post exposure baking
*100°C for negative tone resist soft baking and  post exposure baking
|-
 
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
*100 mm wafers
*150 mm wafers
*200 mm wafers (requires tool change)
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
*Any standard cleanroom material
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
1 - 25
|-
|}
 
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{{:Specific Process Knowledge/Lithography/Development/DUV_developer}}
{{:Specific Process Knowledge/Lithography/Development/DUV_developer}}
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