Specific Process Knowledge/Lithography/Baking: Difference between revisions

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 ![[Specific Process Knowledge/Lithography/Baking#Small_benchtop_hotplates|Small benchtop hotplates]]
 ![[Specific Process Knowledge/Lithography/Baking#Gamma_hotplates|Gamma hotplates]]
-![[Specific_Process_Knowledge/Lithography/Baking#Oven 90C|Oven 90C]]
 ![[Specific_Process_Knowledge/Lithography/Baking#Oven: 110C - 250C|Oven: 110C - 250C]]
 ![[Specific Process Knowledge/Lithography/Pretreatment#Oven 250C|Oven 250C]]
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 *PEB
 *Hard bake
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-Manual convection bake
-*Soft bake
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 Manual convection bake
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 Fixed at various recipe dependent temperatures
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-Fixed at 90°C
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 - 250°C
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 * 150 mm wafer
 * 200 mm wafer
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-* 100 mm wafers
-* 150 mm wafers
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 * 100 mm wafers
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 Silicon and glass substrates
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-Silicon, glass, and polymer substrates
-Film or pattern of all types
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 Silicon, glass, and high Tg polymer substrates
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 Hotplate dependent. Any restrictions will be noted on the hotplate.
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-|III-V, copper, steel substrates
 |III-V, low Tg polymer, copper, steel substrates
 |III-V, low Tg polymer, copper, steel substrates
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 Developer: Stepper:<br /> http://labmanager.dtu.dk/view_binary.php?fileId=4435
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