Specific Process Knowledge/Lithography/Coaters/GammaUV: Difference between revisions

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!style="background:silver; color:black;" align="center" width="60"|Purpose  

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*HMDS priming

*Spin coating of PGMEA based UV resists

!style="background:silver; color:black;" align="center" width="60"|Resist  

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* AZ MiR 701 (29cps)

* AZ nLOF 2020

!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance

|style="background:LightGrey; color:black"|HMDS contact angle

60 - 80°

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|style="background:LightGrey; color:black"|Coating thickness

* AZ MiR 701: 1.5-4 µm

* AZ nLOF 2020: 1.5-5 µm

!style="background:silver; color:black" align="center" valign="center" rowspan="5"|Process parameters

|style="background:LightGrey; color:black"|Priming temperature

120 °C

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|style="background:LightGrey; color:black"|Spin speed

10 - 6000 rpm

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|style="background:LightGrey; color:black"|Spin acceleration

10 - 10000 rpm/s

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|style="background:LightGrey; color:black"|Hotplate temperature

25 - 200 °C

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|style="background:LightGrey; color:black"|Cool plate temperature

21 °C

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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates

|style="background:LightGrey; color:black"|Substrate size

* 50 mm wafers ¹⁾

* 100 mm wafers

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| style="background:LightGrey; color:black"|Allowed materials

Silicon and glass

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|style="background:LightGrey; color:black"|Batch

1 - 25  

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