Specific Process Knowledge/Lithography/Coaters/GammaUV: Difference between revisions
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{| border="2" cellspacing="0" cellpadding="2" | {| border="2" cellspacing="0" cellpadding="2" | ||
!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
*HMDS priming | *HMDS priming | ||
*Spin coating of PGMEA based UV resists | *Spin coating of PGMEA based UV resists | ||
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!style="background:silver; color:black;" align="center" width="60"|Resist | !style="background:silver; color:black;" align="center" width="60"|Resist | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
* AZ MiR 701 (29cps) | * AZ MiR 701 (29cps) | ||
* AZ nLOF 2020 | * AZ nLOF 2020 | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | ||
|style="background:LightGrey; color:black"|HMDS contact angle | |style="background:LightGrey; color:black"|HMDS contact angle | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
60 - 80° | 60 - 80° | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Coating thickness | |style="background:LightGrey; color:black"|Coating thickness | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
* AZ MiR 701: 1.5-4 µm | * AZ MiR 701: 1.5-4 µm | ||
* AZ nLOF 2020: 1.5-5 µm | * AZ nLOF 2020: 1.5-5 µm | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="5"|Process parameters | !style="background:silver; color:black" align="center" valign="center" rowspan="5"|Process parameters | ||
|style="background:LightGrey; color:black"|Priming temperature | |style="background:LightGrey; color:black"|Priming temperature | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
120 °C | 120 °C | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Spin speed | |style="background:LightGrey; color:black"|Spin speed | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
10 - 6000 rpm | 10 - 6000 rpm | ||
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|style="background:LightGrey; color:black"|Spin acceleration | |style="background:LightGrey; color:black"|Spin acceleration | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
10 - 10000 rpm/s | 10 - 10000 rpm/s | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Hotplate temperature | |style="background:LightGrey; color:black"|Hotplate temperature | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
25 - 200 °C | 25 - 200 °C | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Cool plate temperature | |style="background:LightGrey; color:black"|Cool plate temperature | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
21 °C | 21 °C | ||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
* 50 mm wafers <sup>1)</sup> | * 50 mm wafers <sup>1)</sup> | ||
* 100 mm wafers | * 100 mm wafers | ||
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| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
Silicon and glass | Silicon and glass | ||
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|style="background:LightGrey; color:black"|Batch | |style="background:LightGrey; color:black"|Batch | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
1 - 25 | 1 - 25 | ||
|- | |- | ||
Revision as of 14:43, 27 January 2023
Spin Coater: Gamma UV
Spin Coater: Gamma UV was installed at DTU Nanolab in March 2015. It is a Gamma 2M cluster from Süss MicroTec with spin coating, HMDS vapour priming, and baking modules.
The system handles 4" and 6" wafers without size conversion, and can be set up to handle 2" or 8".
The coater is equipped with 3 different resists lines:
- AZ MiR 701
- AZ nLOF 2020
- AZ 5214E
- Syringe, which can be used for various resists
The processes that are available on the system are developed by Nanolab. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and would as a starting point require batches in excess of 20 wafers.
The user manual, quality control procedures and results, user APVs, and contact information can be found in LabManager
Process information
| Purpose |
| |
|---|---|---|
| Resist |
| |
| Performance | HMDS contact angle |
60 - 80° |
| Coating thickness |
| |
| Process parameters | Priming temperature |
120 °C |
| Spin speed |
10 - 6000 rpm | |
| Spin acceleration |
10 - 10000 rpm/s | |
| Hotplate temperature |
25 - 200 °C | |
| Cool plate temperature |
21 °C | |
| Substrates | Substrate size |
|
| Allowed materials |
Silicon and glass Resist and crystalbond is not allowed in the HMDS module | |
| Batch |
1 - 25 |
1) Requires tool change.