Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma UV processing: Difference between revisions

After spin coating, the solvent in the resist formulation must be evaporated in a baking step in order to solidify the resist. This soft bake can be carried out as a contact bake or a proximity bake. In a contact bake, the wafer is held in close contact to the hotplate surface while resting on shallow bumps only 150µm above the hotplate. In a proximity bake, the wafer is first moved into proximity, e.g. 1mm, of the hotplate surface, then held there (on the lift pins) for the duration of the bake. The hotplate temperatures of the baking modules of Spin Coater: Gamma UV are set at temperatures relevant to the resist used, typically 90-110°C. After baking, the wafer is cooled for 20 seconds on the cool plate.

=Standard Processes=

==HMDS priming==

The standard HMDS priming process has been developed to mimic the behavior of the IMTEC Star2000 HMDS oven, which produces a contact angle of 81-82° on an oxidized silicon surface. The fast HMDS priming has been developed to have a process time of approximately one minute, in order to match the process time of typical coating and softbaking processes.