Specific Process Knowledge/Lithography/Resist/UVresist: Difference between revisions
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Manual coaters:<br> | Manual coaters:<br> | ||
*Spin coater: RCD8 | *Spin coater: RCD8 | ||
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|-style="background:Silver; color:black" | |||
!Spectral sensitivity | |||
|310 - 420 nm | |||
|310 - 445 nm | |||
|310 - 380 nm | |||
|310 - 445 nm | |||
|300 - 375 nm | |||
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|-style="background:WhiteSmoke; color:black" | |||
!Exposure tool | |||
|align="center" colspan="5"|Mask aligner or Maskless aligner | |||
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|-style="background:silver; color:black" | |||
!Developer | |||
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*AZ 351B | |||
*AZ 726 MIF | |||
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*AZ 351B | |||
*AZ 726 MIF | |||
|AZ 726 MIF | |||
|AZ 726 MIF | |||
|mr-DEV 600 (PGMEA) | |||
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|-style="background:WhiteSmoke; color:black" | |||
!Rinse | |||
|DIW | |||
|DIW | |||
|DIW | |||
|DIW | |||
|IPA | |||
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|-style="background:silver; color:black" | |||
!Remover | |||
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*Acetone | |||
*Remover 1165 | |||
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*Acetone | |||
*Remover 1165 | |||
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*Acetone | |||
*Remover 1165 | |||
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Remover 1165 | |||
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Cured SU-8 is practically insoluble | |||
Plasma ashing can remove crosslinked SU-8 | |||
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|-style="background:WhiteSmoke; color:black" | |||
!Comments | |||
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*Can be used for both positive and image reversed (negative) processes with resist thickness between 1 and 4 µm. | |||
*Good adhesion for wet etch. | |||
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High selectivity for dry etch | |||
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Negative sidewalls for lift-off | |||
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For processes with resist thickness between 6 µm and 25 µm | |||
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*High aspect ratio | |||
*Resist thickness 1 µm to several 100 µm | |||
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