Specific Process Knowledge/Lithography/Resist/UVresist: Difference between revisions
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The CDA used for the pneumatic autofocus will dehydrate the resist. To reduce this effect, the writehead is parked far away from the write area while setting up the job for at least a few minutes, before starting the exposure. | The CDA used for the pneumatic autofocus will dehydrate the resist. To reduce this effect, the writehead is parked far away from the write area while setting up the job for at least a few minutes, before starting the exposure. | ||
==Aligner: Maskless 03== | ===Aligner: Maskless 03=== | ||
The Aligner: Maskless 03 has a 405 nm laser light source with a FWHM of ~1 nm. | The Aligner: Maskless 03 has a 405 nm laser light source with a FWHM of ~1 nm. | ||