Specific Process Knowledge/Lithography/Resist/UVresist: Difference between revisions
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All doses are for standard silicon wafers, unless otherwise stated. Development is done using 2.38% TMAH. | All doses are for standard silicon wafers, unless otherwise stated. Development is done using 2.38% TMAH. | ||
==KS Aligner== | ===KS Aligner=== | ||
The KS Aligner has an i-line notch filter installed. This results in an exposure light peak around 365 nm with a FWHM of 7 nm. | The KS Aligner has an i-line notch filter installed. This results in an exposure light peak around 365 nm with a FWHM of 7 nm. | ||