Specific Process Knowledge/Lithography/Resist/UVresist: Difference between revisions
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==Aligner: Maskless 03== | ==Aligner: Maskless 03== | ||
=Exposure dose when using AZ 351B developer (NaOH)= | |||
==KS Aligner (351B)== | |||
The KS Aligner has an i-line notch filter installed. This results in an exposure light peak around 365 nm with a FWHM of 7 nm. | |||
{|border="1" cellspacing="1" cellpadding="7" style="text-align:left;" | |||
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!Date | |||
!Thickness | |||
!Dose | |||
!Development] | |||
!Comments | |||
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|-style="background:WhiteSmoke; color:black" | |||
!rowspan="3"|AZ 5214E | |||
|Long ago | |||
|1.5 µm | |||
|70mJ/cm<sup>2</sup> | |||
|60 s | |||
|rowspan="3"|Positive process | |||
|-style="background:WhiteSmoke; color:black" | |||
|Long ago | |||
|2.2 µm | |||
|72 mJ/cm<sup>2</sup> | |||
|70 s | |||
|-style="background:WhiteSmoke; color:black" | |||
|Long ago | |||
|4.2 µm | |||
|160 mJ/cm<sup>2</sup> | |||
|180 s | |||
|- | |||
|- | |||
|-style="background:LightGrey; color:black" | |||
!rowspan="2"|AZ 5214E | |||
|Long ago | |||
|1.5 µm | |||
|30 mJ/cm<sup>2</sup> | |||
|60 s | |||
|rowspan="2"|Image reversal process. | |||
Reversal bake: 100s at 110°C.<br>Flood exposure after reversal bake: 210 mJ/cm<sup>2</sup> | |||
|-style="background:LightGrey; color:black" | |||
|Long ago | |||
|2.2 µm | |||
|35 mJ/cm<sup>2</sup> | |||
|70 s | |||
|- | |||
|- | |||
|-style="background:WhiteSmoke; color:black" | |||
!AZ 4562 | |||
|Long ago | |||
|10 µm | |||
|320 mJ/cm<sup>2</sup> | |||
|5 minutes | |||
|Multiple exposure with 10-15 s pauses is recommended. | |||
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