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Specific Process Knowledge/Thermal Process/RTP Annealsys: Difference between revisions

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*Cleanroom of DTU Nanolab
*Cleanroom of DTU Nanolab
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!style="background:silver; color:black;" align="center" width="60"|Performance
!style="background:silver; color:black;" align="center" width="60"|Substrate
|style="background:LightGrey; color:black"|Resolution
|style="background:LightGrey; color:black"|Resolution
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The resolution is strongly dependent on the type of sample and the skills of the operator.
The resolution is strongly dependent on the type of sample and the skills of the operator.
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!style="background:silver; color:black" align="center" valign="center" rowspan="5"|Instrument specifics
|style="background:LightGrey; color:black"|Detectors
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*Secondary electron (Se2)
*Inlens secondary electron (Inlens)
*High Definition four quadrant Angular Selective Backscattered electron detector (HDAsB)
*Variable pressure secondary electron (VPSE)
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|style="background:LightGrey; color:black"|Stage
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*X, Y: 130 × 130 mm
*T: -4 to 70<sup>o</sup>
*R: 360<sup>o</sup>
*Z: 50 mm
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|style="background:LightGrey; color:black"|Electron source
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*FEG (Field Emission Gun) source
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|style="background:LightGrey; color:black"|Operating pressures
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*Fixed at High vacuum (2 &times; 10<sup>-4</sup>mbar - 10<sup>-6</sup>mbar)
*Variable at Low vacuum (0.1 mbar - 2 mbar)
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|style="background:LightGrey; color:black"|Options
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*High Definition four quadrant Angular Selective Backscattered electron detector (HDAsB)
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
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*Up to 6" wafer with full view
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| style="background:LightGrey; color:black"|Allowed materials
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*Any standard cleanroom material
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