Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/ORE with Al2O3 mask: Difference between revisions
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=== Isotropic etch === | === Isotropic etch === | ||
Some isotropic etches were performed, intercalated with anisotropic etches. The nanoholes are 200nm wide, with 400nm pitch. | Some isotropic etches were performed, intercalated with anisotropic etches. The nanoholes are 200nm wide, with 400nm pitch. | ||
[[File:cpr + iso x2 meas.png|400px|left|thumb|'''''x2 anisotropic + isotropic etch.''''']] | [[File:cpr + iso x2 meas.png|400px|left|thumb|'''''x2 anisotropic + isotropic etch.''''']] | ||
| Line 87: | Line 88: | ||
| O<sub>2</sub> flow (SCCM) | | O<sub>2</sub> flow (SCCM) | ||
| SF<sub>6</sub> flow (SCCM) | | SF<sub>6</sub> flow (SCCM) | ||
| | | Platen power (W) | ||
| Coil power (W) | |||
|- | |- | ||
! rowspan="4" align="center"| Nanoholes etch | ! rowspan="4" align="center"| Nanoholes etch | ||
| O-step | | O-step | ||
| | | 10 | ||
| 220 mTorr | |||
| 200 | |||
| 0 | |||
| 40 | |||
| 0 | |||
|- | |- | ||
| R-step | | R-step | ||