Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/ORE with Al2O3 mask: Difference between revisions

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 Moreover, during the E-step, the MFC (mass flow controller) presented a delay to read the pressure when compared with the power, creating unwanted bias. To fight it, the E-step was divided into E<sub>1</sub> and E<sub>2</sub>. The E<sub>1</sub> of only 2 s is enough to stabilize the pressure, and E<sub>2</sub> the profile is etch correctly, without the unwanted bias.
-[[File:graf bias & recipes.png|800px|center|thumb|'''''CORE process graphics and recipes: a) unwanted DC bias during the E-step; b) E-step separated into two steps, E<sub>1</sub> decreased the bias.''''']]
+[[File:graf bias & recipes.png|600px|center|thumb|'''''CORE process graphics and recipes: a) unwanted DC bias during the E-step; b) E-step separated into two steps, E<sub>1</sub> decreased the bias.''''']]
 === Pillars ===
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 |+ 1μm holes recipe from March 2022 - #288 = 120 min
 |-
-|-style="background:DarkGray; color:White"
+|-style="background:LightGray; color:Black"
 !  !! Time (s) !! Pressure !! O<sub>2</sub> flow (SCCM) !! SF<sub>6</sub> flow (SCCM) !! Platen power (W) !! Coil power (W)
 |-
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 |+ 200nm nanoholes recipe from March 2022
 |-
-|-style="background:DarkGray; color:White"
+|-style="background:LightGray; color:Black"
 !  !! Time (s) !! Pressure (valve control) !! O<sub>2</sub> flow (SCCM) !! SF<sub>6</sub> flow (SCCM) !! Platen power (W)
 |-