Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/ORE with Al2O3 mask: Difference between revisions
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! !! Time (s) !! Pressure (valve control) !! O<sub>2</sub> flow (SCCM) !! SF<sub>6</sub> flow (SCCM) !! Platen power (W) !! Profile | ! !! Time (s) !! Pressure (valve control) !! O<sub>2</sub> flow (SCCM) !! SF<sub>6</sub> flow (SCCM) !! Platen power (W) !! Profile | ||
|- | |- | ||
| '''O-step''' || 10 || 3% || 200 || 0 || 40 | | '''O-step''' || 10 || 3% || 200 || 0 || 40 | ||
|- | |- | ||
| '''R-step''' || 10 || 100% || 0 || 5 || 40 | | '''R-step''' || 10 || 100% || 0 || 5 || 40 | ||
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| '''E<sub>2</sub>-step''' || 7 || 4% || 0 || 350 || 300 | | '''E<sub>2</sub>-step''' || 7 || 4% || 0 || 350 || 300 | ||
[[File:compare pillars.png|400px|thumb|'''''Pillars with different etching times.''''']] | |||
|} | |} | ||