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Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/ORE with Al2O3 mask: Difference between revisions

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Mfarin (talk | contribs)
NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
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=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
''By Maria Farinha @nanolab, Jan 2023''


'''''Important!''''' The pressure settings used below '''''may no longer be permitted''''', always check with the Dry etch group.
'''''Important!''''' The pressure settings used below '''''may no longer be permitted''''', always check with the Dry etch group.
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<br>
<br>
Moreover, during the E-step, the MFC (mass flow controller) presented a delay to read the pressure when compared with the power, creating unwanted bias. To fight it, the E-step was divided into E<sub>1</sub> and E<sub>2</sub>. The E<sub>1</sub> of only 2 s is enough to stabilize the pressure, and E<sub>2</sub> the profile is etch correctly, without the unwanted bias.
Moreover, during the E-step, the MFC (mass flow controller) presented a delay to read the pressure when compared with the power, creating unwanted bias. To fight it, the E-step was divided into E<sub>1</sub> and E<sub>2</sub>. The E<sub>1</sub> of only 2 s is enough to stabilize the pressure, and E<sub>2</sub> the profile is etch correctly, without the unwanted bias.
[[File:graf bias & recipes.png|800px|left|thumb|'''''CORE process graphics and recipes: a) unwanted DC bias during the E-step; b) E-step separated into two steps, E<sub>1</sub> decreased the bias.''''']]
[[File:graf bias & recipes.png|800px|center|thumb|'''''CORE process graphics and recipes: a) unwanted DC bias during the E-step; b) E-step separated into two steps, E<sub>1</sub> decreased the bias.''''']]
 
=== Pillars ===
 
[[File:compare pillars.png|600px|thumb|'''''Pillars with different etching times.''''']]
{| border="1" style="text-align: center; width: 650px; height: 200px"
|+ 1μm Pillar recipe from March 2022
|-
|-style="background:DarkGray; color:White"
!  !! Time (s) !! Pressure (valve control) !! O<sub>2</sub> flow (SCCM) !! SF<sub>6</sub> flow (SCCM) !! Platen power (W)
|-
| '''O-step''' || 10 || 3% || 200 || 0 || 40
|-
| '''R-step''' || 10 || 100% || 0 || 5 || 40
|-
| '''E<sub>1</sub>-step''' || 2 || 4% || 0 || 350 || 40
|-
| '''E<sub>2</sub>-step''' || 7 || 4% || 0 || 350 || 300
|}
 
<br>
 
 
=== Holes ===
 
{| border="1" style="text-align: center; width: 650px; height: 200px"
|+ 1μm holes recipe from March 2022
|-
|-style="background:DarkGray; color:White"
!  !! Time (s) !! Pressure (valve control) !! O<sub>2</sub> flow (SCCM) !! SF<sub>6</sub> flow (SCCM) !! Platen power (W)
|-
| '''O-step''' ||  ||  ||  ||  ||
|-
| '''R-step''' ||  ||  ||  ||  ||
|-
| '''E<sub>1</sub>-step''' ||  ||  ||  ||  ||
|-
| '''E<sub>2</sub>-step''' ||  ||  ||  ||  ||
|}
 
 
=== Nanoholes ===
 
{| border="1" style="text-align: center; width: 650px; height: 200px"
|+ 200nm nanoholes recipe from March 2022
|-
|-style="background:DarkGray; color:White"
!  !! Time (s) !! Pressure (valve control) !! O<sub>2</sub> flow (SCCM) !! SF<sub>6</sub> flow (SCCM) !! Platen power (W)
|-
| '''O-step''' ||  ||  ||  ||  ||
|-
| '''R-step''' ||  ||  ||  ||  ||
|-
| '''E<sub>1</sub>-step''' ||  ||  ||  ||  ||
|-
| '''E<sub>2</sub>-step''' ||  ||  ||  ||  ||
|}


=== Isotropic etch ===


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