Specific Process Knowledge/Back-end processing: Difference between revisions

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These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.
These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.


[[Image:section under construction.jpg|70px|right]]
{| {{table} style="background:LightGray"}
! '''Note! Packlab will be closed from February/March 2023 to Q2 2024 due to the construction of our new PolyFabLab.'''
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| Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.
|-
|}
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Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.  
Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.  


Revision as of 14:38, 21 December 2022

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Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.

Note! Packlab will be closed from February/March 2023 to Q2 2024 due to the construction of our new PolyFabLab.
Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information.


Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.

Choose an equipment

Choose processing method

Lapping/polishing Cutting Milling Die bonding Wire bonding
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