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Specific Process Knowledge/Etch/DRIE-Pegasus/DREM: Difference between revisions

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Jmli (talk | contribs)
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! class="hideImage" width="150" | Transfer pattern to your sample [[file:jehanTransfer.png|130px|frameless ]]
! class="hideImage" width="150" | Transfer pattern to your sample [[file:jehanTransfer.png|130px|frameless ]]
! class="hideImage" width="150" | Define your structure directly [[file:jehandefine.jpg|130px|frameless ]]
! class="hideImage" width="150" | Define your structure directly [[file:jehandefine.jpg|130px|frameless ]]
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! class="hideImage" width="150" height="180px"|  Bond your samples together [[file:jehanBond.png|130px|frameless ]]
! class="hideImage" width="150" | Characterize your sample  [[file:jehanCharacterize.png|130px|frameless ]]
! class="hideImage" width="150" | Pack your sample  [[file:jehanPack.png|130px|frameless ]]
! class="hideImage" width="150" | Process flow examples [[file:processflow_b.png|130px|frameless ]]
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{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Bond your samples together.png|x100px|Bond your samples together]] Bond your samples together
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!Entry page in LabAdviser
!Techniques
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|rowspan="3" valign="top"|[[Specific Process Knowledge/Bonding|Bonding]]
|Eutectic bonding
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|Fusion bonding
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|Anodic bonding
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|[[Specific_Process_Knowledge/Etch/DryEtchProcessing/Bonding |Etch/DryEtchProcessing/Bonding]]
|Temporary bonding of wafers or chips for dry etching
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