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Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4/Slow etch: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,321 edits
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|Etch of Si3N4 with DUV mask
|Etch of SRN
|
|'''~43nm/min [measured 39-50 nm/min over a 6" wafer]
 
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|Etch rate of Si3N4
|Etch rate of Si3N4
|'''~nm/min
|'''~49nm/min [4" on carrier]


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|Etch rate of Silicon
|Etch rate of Silicon
|'''~nm/min
|'''~42nm/min [41-43 nm/min over a 6" wafer]


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