Jump to content

Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4/Slow etch: Difference between revisions

← Older editNewer edit →
VisualWikitext
Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,318 edits
Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,318 edits
Line 12: Line 12:
|-
|-
|Platen Power [W]
|Platen Power [W]
|50
|25


|-
|-
Line 24: Line 24:
|-
|-
|CF<sub>4</sub> flow [sccm]
|CF<sub>4</sub> flow [sccm]
|40
|45


|-
|-
|Pressure [mTorr]
|Pressure [mTorr]
|4
|3


|-
|-
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-4/Slow_etch"