Specific Process Knowledge/Etch/Overview of chemicals: Difference between revisions

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Line 12: Line 12:
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|KOH
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|KOH
|style="background:LightGrey; color:black"|28%
|style="background:LightGrey; color:black"|28%
|style="background:WhiteSmoke; color:black"|C
|style="background:WhiteSmoke; color:black"|C
|style="background:WhiteSmoke; color:black"|C
|-
|-

Revision as of 12:35, 10 October 2022

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Chemical Concentration application Comment
KOH 28% C C
TextB2 C
Process parameter range TextC1
  • DetailC1.1
  • DetailC1.2
  • DetailC1.3
TextC2
  • DetailC2.1
  • DetailC2.2
  • DetailC2.3
Substrates TextD1
  • DetailD1.1
  • DetailD1.2
  • DetailD1.3
TextD2
  • DetailD2.1
  • DetailD2.2
  • DetailD2.3
TextD3
  • DetailD3.1
  • DetailD3.2
  • DetailD3.3
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