Specific Process Knowledge/Etch/ICP Metal Etcher/Chromium: Difference between revisions
| Line 82: | Line 82: | ||
</gallery> | </gallery> | ||
=== Recipe | === Recipe tried out on DUV pattern with 100 nm Cr and approx. 300 nm DUV resist=== | ||
''by bghe@nanolab 2022-09-29'' | ''by bghe@nanolab 2022-09-29'' | ||
* A piece of approx 2cmx2cm was bonded to a Si/SiO2 wafer | * A piece of approx 2cmx2cm was bonded to a Si/SiO2 wafer | ||
*1 min O2 barc etch was done | *1 min O2 barc etch was done | ||
*3min20s of CR_AS_13 | *3min20s of CR_AS_13 | ||
====Results==== | |||
*Clearly too little resist for this etch | |||
<gallery> | |||
Image:S0338_51_05.jpg | |||
Image:S0338_51_06.jpg | |||
Image:S0338_51_01.jpg | |||
Image:S0338_51_03.jpg | |||
Image:S0338_51_04.jpg | |||
Image:S0338_51_00.jpg | |||
Image:S0338_51_07.jpg | |||
</gallery> | |||
==Chromium etch in ICP metal on a thick glass substrate== | ==Chromium etch in ICP metal on a thick glass substrate== | ||