Specific Process Knowledge/Etch/ICP Metal Etcher/Chromium: Difference between revisions
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* [[:File:report_summer2022 Anders Simonsen bghe edits.pdf | Cr etch development report summery by Anders Simonesen, summer of 2022 ]] | * [[:File:report_summer2022 Anders Simonsen bghe edits.pdf | Cr etch development report summery by Anders Simonesen, summer of 2022 ]] | ||
* [[/Cr etch data from AS |Here are the raw test data and SEM images from Anders Simonsen]] | * [[/Cr etch data from AS |Here are the raw test data and SEM images from Anders Simonsen]] | ||
Preferer result: | |||
The SEM images where done after both the Cr etch and the silicon nitride etch in the AOE using the recipe "?". The important thing was to see how well the Cr works for masking the nitride given vertical and smooth sidewalls in the nitride. | |||
{| class="wikitable" | |||
! Recipe !! Pressure [mTorr] !! Coil power [W] !! Platen power [W] !! Total Flow Cl2+O2 [sccm] !! O2% !! Temp !! !! Time [s] !! CSAR etch rate [nm/min] !! CSAR rate w bond !! !! Etch rate [nm/min] !! Selectivity !! !! coil load !! coil tune !! plat load !! plat tune !! Comment | |||
|- | |||
! test13/laqs | |||
| 10 || 300 || 15 || 30 || 23.33 || 20 || || 28 || 100.71 || || || 42.86 || 0.43 || || || || || || This recipe was chosen over no. 12 because it did not need a large over etch of the Cr (no foot). | |||
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==Chromium etch in ICP metal on a thick glass substrate== | ==Chromium etch in ICP metal on a thick glass substrate== | ||