Jump to content

Specific Process Knowledge/Etch/ICP Metal Etcher/Chromium: Difference between revisions

Bghe (talk | contribs)
Bghe (talk | contribs)
Line 61: Line 61:
Anders has done some work on optimizing the Cr etch for at 20-40 nm thick Cr that was to be used as masking for a silicon nitride etch. The Cr etch was carriered out on the ICP metal and the silicon nitride etch was done on the AOE. You can see his results in this summery that he has made:
Anders has done some work on optimizing the Cr etch for at 20-40 nm thick Cr that was to be used as masking for a silicon nitride etch. The Cr etch was carriered out on the ICP metal and the silicon nitride etch was done on the AOE. You can see his results in this summery that he has made:
* [[:File:report_summer2022 Anders Simonsen bghe edits.pdf | Cr etch development report summery by Anders Simonesen, summer of 2022 ]]
* [[:File:report_summer2022 Anders Simonsen bghe edits.pdf | Cr etch development report summery by Anders Simonesen, summer of 2022 ]]
* [[/Cr etch data from AS |Here are the raw test data and SEM images from Anders Simonsen]]


==Chromium etch in ICP metal on a thick glass substrate==
==Chromium etch in ICP metal on a thick glass substrate==