Specific Process Knowledge/Etch/ICP Metal Etcher/Chromium: Difference between revisions
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==Chromium etch in ICP metal - small substrate using carrier== | |||
The Chromium etch was carried out on the following substrate stack: | The Chromium etch was carried out on the following substrate stack: | ||
2" Si wafer with Cr laying in a 6" Si wafer with a 4" recess. The area outside the recess was covered by AZ resist. | 2" Si wafer with Cr laying in a 6" Si wafer with a 4" recess. The area outside the recess was covered by AZ resist. | ||
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===Chromium etch in ICP metal on a thick glass substrate | ==Chromium etch of hardmask for silicon nitride etching by Anders Simonson@nbi.ku== | ||
''Added by bghe@Nanolab'' | |||
==Chromium etch in ICP metal on a thick glass substrate== | |||
The Chromium etch has ONLY been carried out on the following substrate stack: | The Chromium etch has ONLY been carried out on the following substrate stack: | ||
The Chromium is sputter deposited onto a 2" quartz wafer and patterned by e-beam with Zep520A resist. | The Chromium is sputter deposited onto a 2" quartz wafer and patterned by e-beam with Zep520A resist. | ||