Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions
removed physimeca |
|||
| Line 122: | Line 122: | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Comment | ! Comment | ||
| | | | ||
| | | | ||
*[[/Stress Wordentec Ni films|Stress in Wordentec Ni films: study here]]. | *[[/Stress Wordentec Ni films|Stress in Wordentec Ni films: study here]]. | ||
| | | | ||
*May use high-strength magnet for deposition. | *May use high-strength magnet for deposition. | ||
| Line 140: | Line 139: | ||
'''**''' ''To deposit a cumulative thickness above 200 nm permission is required from metal@nanolab.dtu.dk to ensure enough material is present in the machine'' | '''**''' ''To deposit a cumulative thickness above 200 nm permission is required from metal@nanolab.dtu.dk to ensure enough material is present in the machine'' | ||
==Quality control of e-beam evaporated Ni films== | ==Quality control of e-beam evaporated Ni films== | ||