Specific Process Knowledge/Back-end processing/Polishing machine: Difference between revisions
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[[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]] | [[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]] | ||
Training is required before using th machine. The machine is equipped with a LabManager lock. | |||
The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates. | The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates. | ||