Specific Process Knowledge/Characterization/Stress measurement: Difference between revisions
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A thin film can exhibit either compressive or tensile stress as illustrated by Figure 1: | A thin film can exhibit either compressive or tensile stress as illustrated by Figure 1: | ||
[[File:berit-film-stress-illustration-cropped.png|upright=3|alt=A rectangle illustrates a substrate without stress. A downward curving section of a sphere with a red band on top illustrates a substrate with compressive stress due to a thinfilm. An upward curving section of a sphere with a green band on top illustrates a substrate with tensile stress.|right|thumb|Figure 1: Compressive and tensile stress (figure by Berit Herstrøm).]] | [[File:berit-film-stress-illustration-cropped.png|upright=3|alt=A rectangle illustrates a substrate without stress. A downward curving section of a sphere with a red band on top illustrates a substrate with compressive stress due to a thinfilm. An upward curving section of a sphere with a green band on top illustrates a substrate with tensile stress.|right|thumb|Figure 1: Compressive and tensile stress (figure by Berit Herstrøm).]] | ||
Examples of thin films that exhibit tensile stress include Cr, Ni, and SiO2 made by LPCVD TEOS. SiN made by PECVD can exhibit either tensile or compressive stress. The same is true for sputtered Si. | |||
Here you can find some information about [[Specific Process Knowledge/Thin film deposition/Lesker/Stress dependence on sputter parameters in the Lesker sputter system|stress in sputtered films]] made at Nanolab. There is also a recommendation for a general reference to read. | |||
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==Stress measurement using a profilometer== | ==Stress measurement using a profilometer== | ||