Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 02 processing: Difference between revisions
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'''Optical:''' Defocus varies greatly with resist type and thickness, see [[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Process_Parameters|Process Parameters]]. Probably also dependent on substrate. Should work for substrates down to 3x3mm<sup>2</sup>. | '''Optical:''' Defocus varies greatly with resist type and thickness, see [[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Process_Parameters|Process Parameters]]. Probably also dependent on substrate. Should work for substrates down to 3x3mm<sup>2</sup>. | ||
'''Pneumatic:''' Defocus is probably similar for resists of similar thickness, and not likely to vary with substrate. For 375nm exposure, the optimum seems to be around -15 to -10 ([[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Large_defocus_range|Large defocus range]]). Substrates must be at least | '''Pneumatic:''' Defocus is probably similar for resists of similar thickness, and not likely to vary with substrate. For 375nm exposure, the optimum seems to be around -15 to -10 ([[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Large_defocus_range|Large defocus range]]). Substrates must be at least 20x20mm<sup>2</sup> to be successfully loaded, probably larger to successfully print. <span style="color:red">(July 2022: The pneumatic AF has been disabled)</span> | ||
==Exposure mode== | ==Exposure mode== | ||