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Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions

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Other resist have to be developed in the E-beam developer fumehood in E-4 in beakers. Please notice the are specific beaker sets for alkaline developers and for solvent based developers.
Other resist have to be developed in the E-beam developer fumehood in E-4 in beakers. Please notice the are specific beaker sets for alkaline developers and for solvent based developers.
== Cold development ==
<span style="font-size: 90%; text-align: right;">[[Specific_Process_Knowledge/Lithography/EBeamLithography/JEOL_JBX-9500FSZ#top|Go to top of this page]]</span>
[[Image:Coolplate2.jpg|250px|right|]]
We do have the possibility of making cold development, to get more vertical and smoother sidewalls. We have a coolplate that can go down to -2°C, with a ramp of app. 3 °C/min.
Is it recommended to make a dose test, if one is to transfer from ordinary development to cold.
'''Procedure'''
# Pour developer suited for your resist into a small blue cap bottle, and label it, remember to mark it with lot number, date and your name.
# Leave this small bottle of developer in the fridge in Cx1 at least overnight to acclimatize.
# Take the coolplate located in D3 (see picture) and connect it in Fumehood 10 (E-beam) place it on the sink-lid to keep a good airflow.
# Hold left button on the front panel of the cool plate and set temperature with up/down arrows.
# The cool plate can go down to -2°C, and the fridge is +5°C hence use a beaker and pour cold developer into it and place on the coolplate, leave it to acclimatize for the desired temperature.
Development time in cold development, should be subject to testing, depending on structure size and density, but is comparable with "normal" development times.
When developing at low temperatures, condensation can occur
'''Remember to clean up after you are done'''
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= Proximity Error Correction (PEC) =
= Proximity Error Correction (PEC) =