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Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions

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= Development =
= Development =


There are many different developers for different E-beam resist, but since CSAR and ZEP520A are the most used at Nanolab, we have installed a semi automatic puddle developer: '''[[Specific_Process_Knowledge/Lithography/Development#Developer:_E-beam|Developer E-beam]]''' in E-4.
AR 600-545 and ZED N-50 developers are available in a semi automatic puddle developer '''[[Specific_Process_Knowledge/Lithography/Development#Developer:_E-beam|Developer E-beam]]''' in E-4. It has automatic recipes for puddle development cycles for 10, 30 and 60 seconds of either of the two developers, each finishing off with an IPA rinse and drying cycle.


To accommodate most users, this tool uses developers: AR 600-546 for development of CSAR 6200 resist series and ZED N-50 for ZEP520A resists and IPA as a rinsing step.
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We recommend to use:
*ZED N-50 for ZEP520A
*AR 600-546 for CSAR 6200 series


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Other resist have to be developed in the E-beam developer fumehood in E-4 in beakers. Please notice the are specific beaker sets for alkaline developers and for solvent based developers.
The recipes are divided into different developer and development times.


The recipes 546 are short for AR 600-546 and N-50 is short for ZED N-50.<br>
After the developer there is a time indication eg. 10s, 30s, 60s ect.
Since this system is a spray nozzle that creates a puddle of developer on the substrate the spray is on for 10s. to cover any type of substrates, however this procedure starts the actual development, and the "idle" time is hence shortened accordingly.
The system is setup so that 10s. in the Developer E-beam correlates to 10s. in a beaker, however all designs are different and larger or smaller structures may need different development times. 


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== Cold development ==
== Cold development ==