Specific Process Knowledge/Thin film deposition/Temescal/Acceptance Test: Difference between revisions
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In the acceptance test, we tested the vacuum performance, the ion source, and the uniformity of the deposited metal films. The test was made in March 2018 by Rebecca Ettlinger and Camilla Tingsager. | In the acceptance test, we tested the vacuum performance, the ion source, and the uniformity of the deposited metal films. The test was made in March 2018 by Rebecca Ettlinger and Camilla Tingsager. | ||
The uniformity of the ion beam etch was tested on Si wafers with SiO<sub>2</sub> coating of a known thickness. | The uniformity of the ion beam etch was tested on Si wafers with SiO<sub>2</sub> coating of a known thickness. It was measured by ellipsometry. | ||
For metal films | For metal films the thickness was measured with a stylus profiler and for Ti/Ni the sheet resistance uniformity was measured by Capres. | ||
Side wall coverage was evaluated in SEM for Ti/Au films deposited at normal incidence (what most users require, which gives no side-wall deposition) and with various degrees of tilt. | Side wall coverage was evaluated in SEM for Ti/Au films deposited at normal incidence (what most users require, which gives no side-wall deposition) and with various degrees of tilt. | ||