Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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2 Technical specifications | 2 Technical specifications | ||
2.1 Hardware | 2.1 Hardware summary | ||
* Endpoint detection | |||
* 5KW 13.56MHz RF power supply and fast acting matching unit | |||
* Low notching Silicon On Insulator (SOI) capability | |||
* MACS (Multiplex Atmospheric Cassette Station) | |||
2.2 Wafer requirements | 2.2 Wafer requirements | ||