Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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1.6 Overview of equipment | 1.6 Overview of equipment | ||
The load lock and MACS | |||
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2. 3 Standard processes | 2. 3 Standard processes | ||
2.3.1 Process A Large trench | |||
2.3.1 Process B Via etch | |||
2.3.1 Process C Microstamp | |||
2.3.1 Process D Nanostamp | |||
3 Processing | 3 Processing | ||
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4 Recipes | 4 Recipes | ||
5 Datalogs | |||
5 Process development | |||
Go to the Danchip LabAdviser page to find the most recent process development. | |||
6 | |||
8) Processing guidelines and instructions | 8) Processing guidelines and instructions | ||