Jump to content

Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions

Jehan (talk | contribs)
Jehan (talk | contribs)
Line 66: Line 66:
*Color screen
*Color screen
|-
|-
!style="background:silver; color:black;" align="left"|Purpose  
!style="background:silver; color:black;" align="left" rowspan="2"|Purpose  
|style="background:LightGrey; color:black"|Equipment for dicing out samples
|style="background:LightGrey; color:black"|Main usage
|style="background:WhiteSmoke; color:black"|
Dicing Borofloat and Fused Silica wafers
|style="background:WhiteSmoke; color:black"|
Dicing Silicon wafers
|-
|style="background:LightGrey; color:black"|Wafer type
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*'''Pyrex/Borofloat'''
*'''Pyrex/Borofloat'''
*'''Fused Silica'''
*'''Fused Silica'''
*'''Silicon-Carbide (SiC)'''
*'''Silicon bonded to Pyrex/Borofloat'''
*'''Silicon bonded to Pyrex/Borofloat'''
*'''Silicon bonded to Silicon'''
*'''Silicon bonded to Silicon'''
* Other materials - ask
*Pure Silicon samples
*Pure Silicon samples
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Line 80: Line 86:
*Silicon bonded to Silicon
*Silicon bonded to Silicon
*Silicon bonded to Pyrex/Borofloat
*Silicon bonded to Pyrex/Borofloat
* Other materials - ask
|-
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="5"|Performance
!style="background:silver; color:black" align="left" valign="top" rowspan="5"|Performance