Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
Appearance
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*Color screen | *Color screen | ||
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!style="background:silver; color:black;" align="left"|Purpose | !style="background:silver; color:black;" align="left" rowspan="2"|Purpose | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|Main usage | ||
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Dicing Borofloat and Fused Silica wafers | |||
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Dicing Silicon wafers | |||
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|style="background:LightGrey; color:black"|Wafer type | |||
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*'''Pyrex/Borofloat''' | *'''Pyrex/Borofloat''' | ||
*'''Fused Silica''' | *'''Fused Silica''' | ||
*'''Silicon bonded to Pyrex/Borofloat''' | *'''Silicon bonded to Pyrex/Borofloat''' | ||
*'''Silicon bonded to Silicon''' | *'''Silicon bonded to Silicon''' | ||
* Other materials - ask | |||
*Pure Silicon samples | *Pure Silicon samples | ||
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*Silicon bonded to Silicon | *Silicon bonded to Silicon | ||
*Silicon bonded to Pyrex/Borofloat | *Silicon bonded to Pyrex/Borofloat | ||
* Other materials - ask | |||
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!style="background:silver; color:black" align="left" valign="top" rowspan="5"|Performance | !style="background:silver; color:black" align="left" valign="top" rowspan="5"|Performance | ||