Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions

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 ===Comparing dicing parameters for different materials '''DAD 321'''===
+Do not mix blades for the DAD 321 with the blades for the DAD 3241. They have different outer diameters
 {| border="2" cellspacing="0" cellpadding="4" align="center"
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 This leaves 125µm uncut since blue tape is 75µm.<br>
 It is possible to cut through the sample.
+|-valign="top"
+|'''Max. sample thickness'''
+|1.5 mm
+|2.0 mm
+|-
+|}
+===Comparing dicing parameters for different materials '''DAD 3241'''===
+Do not mix blades for the DAD 321 with the blades for the DAD 3241. They have different outer diameters
+{| border="2" cellspacing="0" cellpadding="4" align="center"
+!
+!Silicon
+!Other materials
+|- valign="top"
+|'''Bladetype'''
+|HUB Blade
+|ASK! (HUBless)
+|-valign="top"
+|'''Blade width'''
+|50 µm
+|ask
+|-valign="top"
+|'''Cutlinewidth'''
+|50 µm
+|ask
+|-valign="top"
+|'''Recommended feed speed'''
+|Up to 40 mm/sec
+|ask
+|-valign="top"
+|'''Recommended dice depth'''
+|We usually cut all way through the wafer with a blade height of 50µm (preferred).<br>
+|ask!
 |-valign="top"
 |'''Max. sample thickness'''