Specific Process Knowledge/Back-end processing/Disco Saw

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Disco Automatic dicing saw, model DAD321 (old) and DAD3241 (new 2021)

The dicers feature versatile processing capabilities, compact designs, and high precision and reliability. Users perform workpiece loading, alignment, and unloading manually.

The dicers at DTU Nanolab is placed in room 157 on the first floor in bldg. 346. Please notice that this is not a cleanroom and that the dicing process is very dirty.

Dicer positioned on 1. floor bldg 346 room 157

In general it is not allowed to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this. Your samples have to be thoroughly cleaned in the gowning area and get a Piranha cleaning. You will only be allowed to use a limited number of tools for the processing after dicing.

Please consider your layout of dies on your wafer. The dicer can only cut straight lines across the wafer and you can not end a line in the middle of the wafer. Please see the illustrations for a good and a bad design.

GOOD design - simple	GOOD design - complex	BAD design
GOOD design - simple	GOOD design - complex	BAD design

The user manual, user APV, technical information and contact information can be found in LabManager:

DAD 321 Saw in LabManager DAD 3241 Saw in LabManager

Process information

• Comparing dicing parameters for different materials
• Images of diced samples
• Dicing work sheet: Dicing.doc Fill out before requesting dicing.

Overview of the performance Disco DAD321 Dicer

Purpose	Dicer	DAD 321 (old)|	DAD 3241 (new 2021)|
Purpose	Equipment for dicing out samples	Pyrex/Borofloat Fused Silica Silicon-Carbide (SiC) Silicon bonded to Pyrex/Borofloat Silicon bonded to Silicon Pure Silicon samples	Pure Silicon samples Pyrex/Borofloat Silicon bonded to Silicon Silicon bonded to Pyrex/Borofloat
Performance	X-axis cutting range	192 mm	2xx mm
	X-axis cut speed	0.1 - 300 mm/sec	??? mm/sec
	Y-axis cutting range	162 mm	2xx mm
	Y-axis index step	0.0002 mm	0.0002 mm
	Y-axis single error	0.003 or less	0.003 or less
Hardware settings	Maximum blade size	ø76.2 mm	ø76.2 mm
Substrates	Substrate size	up to 6"	up to 8"
	Layers that can't be diced	Thick metal (>0.75 mm) III-V samples	Thick metal (>0.75 mm) III-V samples

Comparing dicing parameters for different materials DAD 321

	Silicon	Pyrex or bonded Si/Pyrex
Bladetype	HUB Blade ZH05 (27HEEF)	HUBless Blade B1A862
Blade width	50 µm	150 µm
Cutlinewidth	60 µm	180 - 200 µm
Recommended feed speed	Up to 20 mm/sec	Up to 2 mm/sec (0.5 mm/sec)
Recommended dice depth	Set blade height to 200µm (preferred). This leaves 125µm uncut since blue tape is 75µm. It is possible to cut through the sample.	Do not cut deeper than 500 µm in each pass (for fused Silica and SiC 200 µm). If you have thicker wafers then use several passes decreasing the blade height for each pass. For 500 µm thick wafers set blade height to 200µm (preferred). This leaves 125µm uncut since blue tape is 75µm. It is possible to cut through the sample.
Max. sample thickness	1.5 mm	2.0 mm

Images of diced samples

Si V-groove diced with ZH05 blade