Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
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!style="background:silver; color:black;" align="left"|Purpose | |||
|style="background:LightGrey; color:black"|Dicer | |||
|style="background:WhiteSmoke; color:black"| | |||
DAD 321 (old)| | |||
|style="background:WhiteSmoke; color:black"| | |||
DAD 3241 (new 2021)| | |||
|- | |- | ||
!style="background:silver; color:black;" align="left"|Purpose | !style="background:silver; color:black;" align="left"|Purpose | ||
|style="background:LightGrey; color:black"|Equipment for dicing out samples | |style="background:LightGrey; color:black"|Equipment for dicing out samples | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*'''Pyrex/Borofloat''' | |||
*'''Fused Silica''' | |||
*'''Silicon-Carbide (SiC)''' | |||
*'''Silicon bonded to Pyrex/Borofloat''' | |||
*'''Silicon bonded to Silicon''' | |||
*Pure Silicon samples | *Pure Silicon samples | ||
|style="background:WhiteSmoke; color:black"| | |||
*'''Pure Silicon samples''' | |||
*Pyrex/Borofloat | |||
*Silicon bonded to Silicon | *Silicon bonded to Silicon | ||
*Silicon bonded to Pyrex/Borofloat | *Silicon bonded to Pyrex/Borofloat | ||
|- | |- | ||
!style="background:silver; color:black" align="left" valign="top" rowspan="5"|Performance | !style="background:silver; color:black" align="left" valign="top" rowspan="5"|Performance | ||
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|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
192 mm | 192 mm | ||
|style="background:WhiteSmoke; color:black"| | |||
2xx mm | |||
|- | |- | ||
|style="background:LightGrey; color:black"|X-axis cut speed | |style="background:LightGrey; color:black"|X-axis cut speed | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
0.1 - 300 mm/sec | 0.1 - 300 mm/sec | ||
|style="background:WhiteSmoke; color:black"| | |||
??? mm/sec | |||
|- | |- | ||
|style="background:LightGrey; color:black"|Y-axis cutting range | |style="background:LightGrey; color:black"|Y-axis cutting range | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
162 mm | 162 mm | ||
|style="background:WhiteSmoke; color:black"| | |||
2xx mm | |||
|- | |- | ||
|style="background:LightGrey; color:black"|Y-axis index step | |style="background:LightGrey; color:black"|Y-axis index step | ||
|style="background:WhiteSmoke; color:black"| | |||
0.0002 mm | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
0.0002 mm | 0.0002 mm | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Y-axis single error | |style="background:LightGrey; color:black"|Y-axis single error | ||
|style="background:WhiteSmoke; color:black"| | |||
0.003 or less | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
0.003 or less | 0.003 or less | ||
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!style="background:silver; color:black" align="left"|Hardware settings | !style="background:silver; color:black" align="left"|Hardware settings | ||
|style="background:LightGrey; color:black"|Maximum blade size | |style="background:LightGrey; color:black"|Maximum blade size | ||
|style="background:WhiteSmoke; color:black"| | |||
ø76.2 mm | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
ø76.2 mm | ø76.2 mm | ||
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|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
up to 6" | up to 6" | ||
|style="background:WhiteSmoke; color:black"| | |||
up to 8" | |||
|- | |- | ||
| style="background:LightGrey; color:black"|Layers that can't be diced | | style="background:LightGrey; color:black"|Layers that can't be diced | ||
|style="background:WhiteSmoke; color:black"| | |||
*Thick metal (>0.75 mm) | |||
*III-V samples | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Thick metal (>0.75 mm) | *Thick metal (>0.75 mm) | ||
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<br clear="all" /> | <br clear="all" /> | ||
===Comparing dicing parameters for different materials=== | ===Comparing dicing parameters for different materials '''DAD 321'''=== | ||
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|'''Recommended dice depth''' | |'''Recommended dice depth''' | ||
|Set blade height to 200µm (preferred).<br>This leaves 125µm uncut since blue tape is 75µm.<br> It is possible to cut through the sample. | |Set blade height to 200µm (preferred).<br>This leaves 125µm uncut since blue tape is 75µm.<br> It is possible to cut through the sample. | ||
| | |Do not cut deeper than 500 µm in each pass (for fused Silica and SiC 200 µm). If you have thicker wafers then several passes decreasing the blade height for each pass. | ||
For 500 µm thick wafers set blade height to 200µm (preferred).<br>This leaves 125µm uncut since blue tape is 75µm.<br> It is possible to cut through the sample. | |||
|-valign="top" | |-valign="top" | ||
|'''Max. sample thickness''' | |'''Max. sample thickness''' | ||