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Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
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Thope (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
2,179 edits
Line 68: Line 68:
*2 x 4" wafers
*2 x 4" wafers
*1 x 6" wafer
*1 x 6" wafer
*1 x 8" wafer
*Special wafer cassette with slit openings of 20 mm (position A), 12 mm (position B), 8 mm (position C) and 4 mm (position D).
*Special wafer cassette with slit openings of 20 mm (position A), 12 mm (position B), 8 mm (position C) and 4 mm (position D).
|style="background:WhiteSmoke; color:black"| Only chips, max dimension about 20 x 20 mm.
|style="background:WhiteSmoke; color:black"| Chips holder for chips up to about 75 x 75 mm. 4" wafer holder and 6" wafer holder (stage movement limited to central 100 x 100 mm region)
(If at least one dimension is less than 23 mm, bigger chips (e.g. 40 x 20) may be allowed - contact Nanolab)
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