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Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions

Jmli (talk | contribs)
Jmli (talk | contribs)
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Always make sure that the temperature settings in the recipes are ''not'' enabled. Click [[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/TemperatureSettings |'''here''']] to have more information.
Always make sure that the temperature settings in the recipes are ''not'' enabled. Click [[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/TemperatureSettings |'''here''']] to have more information.
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{{Template:Peg2configcontent1
|ItemName= RF power and pressure settings
|ItemConfiguration= All recipes run without coil power, very low platen power and low pressures
|ItemComment=None of the recipes use coil power in order to prevent aluminium fluoride formation at the aluminium oxide dome. These particles may drop on the wafer or chuck and cause abnormalitites.


Most of the recipes rely on very low pressure and low power - 0.2 mTorr and 10 Watt platen power is not an error and easily supports the plasma.
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{{Template:Peg2configcontent1
{{Template:Peg2configcontent1
|ItemName= Carbon free plasmas
|ItemName= Carbon free plasmas