Specific Process Knowledge/Lithography/EBeamLithography/eLINE: Difference between revisions
Line 8: | Line 8: | ||
[[File:eLINE-Areas.png]] | [[File:eLINE-Areas.png]] | ||
[[File:eLINE-Curved.png]] | |||
[[File:eLINE-Lines.png]] | |||
[[File:eLINE-Dots.png]] | |||
Table of dose to clear on Si substrate: | Table of dose to clear on Si substrate: |
Revision as of 22:55, 14 June 2022
THIS PAGE IS UNDER CONSTRUCTION
Process information for the Raith eLINE Plus system
The system was installed in the cleanroom in May 2022. As we get more familiar with the tool this page will be populated with relevant process information.
Dose information
The eLINE tool operates with four different dose types; area dose [µC/cm2], curved element dose [µC/cm2], line dose [pC/cm] and dot dose [pC]. Notice how the units are different for the line and dot doses. Also notice that the unit prefix changes from micro to pico. The dose for each type can be setup in a master setting under the "Patterning Parameter" and hence be valid for all exposures or they can be set for each individual element of a position list.
Table of dose to clear on Si substrate:
Dose [µC/cm2] | |||
---|---|---|---|
Acc. voltage | AR-P 6200.09 (180 nm) | PMMA 950k | AR-N 8200.xx |
10 kV | 30 | ||
20 kV | 70 | ||
30 kV | 100 |